ASUS Upgrade Bundle – PRIME B550-PLUS AMD AM4 DDR4 ATX Motherboard & PRIME AP303 Mesh Mid-Tower ATX Case – Black
Start your AMD build the smart way with this ASUS PRIME Bundle, pairing the dependable PRIME B550-Plus motherboard with the clean and practical PRIME AP303 Mesh mid-tower case. PCIe 4.0 M.2 storage, USB 3.2 Gen 2 Type-C, Aura Sync RGB, a mesh front panel and 360mm top radiator support deliver a capable and well-ventilated foundation for any Ryzen 3000 series gaming or productivity build.
Features
General
| SKU | ASU-UWM-032 |
Features
| Brand | Asus |
| Model Number | AWD-PRIME-B550-PLUS-AP303-MESH-BLK |
| Key Features |
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Description
ASUS Upgrade Bundle – PRIME B550-Plus AMD AM4 DDR4 ATX Motherboard & PRIME AP303 Mesh Mid-Tower ATX Case – Black
Start your AMD build the smart way with this ASUS PRIME Bundle, pairing the dependable PRIME B550-Plus motherboard with the clean and practical PRIME AP303 Mesh mid-tower case. PCIe 4.0 M.2 storage, USB 3.2 Gen 2 Type-C, Aura Sync RGB, a mesh front panel and 360mm top radiator support deliver a capable and well-ventilated foundation for any Ryzen 3000 series gaming or productivity build.
PRIME B550-Plus Motherboard
Built on the AMD B550 chipset with an AM4 socket, the PRIME B550-Plus supports 3rd Gen AMD Ryzen processors with a PCIe 4.0 x16 primary slot and dual M.2 slots including a PCIe 4.0 x4 slot supporting NVMe RAID for fast and flexible storage. USB 3.2 Gen 2 Type-A and Type-C rear connectivity, 1Gb Ethernet and comprehensive cooling via VRM and PCH heatsinks with Fan Xpert 4 provide a solid and dependable platform. Aura Sync with an addressable Gen 2 RGB header and premium Japanese audio capacitors with audio shielding complete a well-rounded entry-level AM4 feature set.
PRIME AP303 Mesh Mid-Tower Case
The PRIME AP303 Mesh is a clean and compact mid-tower case built for practical and efficient builds. The mesh front panel maximises airflow into the chassis, while top radiator support up to 360mm provides liquid cooling flexibility. Supporting ATX, Micro-ATX and Mini-ITX motherboards with GPU clearance up to 360mm, a pre-installed 120mm rear fan and a USB 3.2 Gen 2x2 Type-C front port, it delivers everything you need for a straightforward and capable gaming or productivity build.
Specifications
PRIME B550-Plus
General
Form Factor: ATXDimensions: 30.5cm x 24.4cm
Chipset: AMD B550
Socket: AM4
Operating System: Windows 10 64-bit
Processor Support
3rd Gen AMD Ryzen Processors (AM4)Memory
Slots: 4x DDR4 UDIMMMaximum Capacity: 128GB
Memory Channels: Dual Channel
Storage
M.2_1: PCIe 4.0 x4, Supports up to 22110, NVMe RAID SupportM.2_2: PCIe M.2 Slot
Onboard Graphics
1x HDMI 2.1Audio
7.1 Surround Sound HD AudioAudio Shielding: Yes
Premium Japanese Capacitors: Yes
Separate PCB Layers for Left and Right Tracks: Yes
USB
USB 3.2 Gen 2 Type-A (Rear)USB 3.2 Gen 2 Type-C (Rear)
Networking
Wired: 1Gb EthernetSpecial Features
PCIe 4.0 SupportAura Sync ARGB
Addressable Gen 2 RGB Header
VRM Heatsink
PCH Heatsink
Fan Xpert 4
PRIME AP303 Mesh
General
Case Type: Mid-TowerPrimary Colour: Black
Front Panel: Mesh
Weight: 6.8kg
Dimensions
Width: 215mmHeight: 425mm
Depth: 485mm
Motherboard Support
ATXMicro-ATX
Mini-ITX
Clearance
Maximum CPU Cooler Height: 165mmMaximum GPU Length: 360mm
Maximum PSU Length: 180mm
Maximum Cable Management Space: 34mm
Drive Bays
1x 2.5" / 3.5" Combo Bay2x 2.5" Bay
Expansion
Expansion Slots: 7Cooling
Pre-Installed Fans: 1x 120mm (Rear)Fan Support
Top: 3x 120mm, 3x 140mm
Rear: 1x 120mm
Radiator Support
Top: 120mm, 140mm, 240mm, 280mm, 360mm
Rear: 120mm
Front I/O
1x USB 3.2 Gen 2x2 Type-C2x USB 3.2 Gen 1
1x Headphone / Microphone Combo Jack
