KLEVV FIT V DDR5 32GB (2x 16GB) 6000MHz CL30 Gaming Memory RAM Kit - White - KD5AGU880-60A300F

KLEVV FIT V DDR5 32GB (2x 16GB) 6000MHz CL30 Gaming Memory RAM Kit - White - KD5AGU880-60A300F

The KLEVV FIT V DDR5 is a 32GB dual-channel kit of two 16GB modules running at 6000MHz with tight CL30 timings, built on SK Hynix A-Die. At just 33.2mm tall it is one of the lowest-profile performance kits available, clearing large tower coolers that force taller kits into awkward compromises. Pre-programmed Intel XMP 3.0 and AMD EXPO profiles mean one BIOS click reaches rated speed on either platform.

DDR5-6000 CL30: The Performance Sweet Spot

DDR5-6000 with CL30 timings is widely regarded as the sweet spot for current Intel and AMD platforms, particularly on AMD's AM5 where 6000MT/s aligns with the optimal Infinity Fabric ratio. Frequency alone is only half the picture: a high-frequency kit with loose timings can perform worse than a slower kit with tight ones, and CL30 at 6000MHz is a genuinely strong combination rather than a headline number. Primary timings of 30-36-36-76 keep real-world latency low for gaming, compilation and content creation alike.

SK Hynix A-Die

The modules are built on SK Hynix A-Die, which matters more than most spec sheet entries. KLEVV is a brand of Essencore, an SK Hynix affiliate, so it has direct access to the ICs rather than buying them on the open market. A-Die is the die most sought after by memory overclockers for its headroom and consistency, so there is scope to push beyond the rated profile if you want to tune manually. On-die ECC and an onboard PMIC handle data integrity and power delivery at the module level, both DDR5 improvements over DDR4.

33.2mm Low Profile for Cooler Clearance

At 33.2mm the low-profile aluminium heat spreader is the FIT V's defining practical advantage. Tall heat spreaders routinely foul large air coolers, forcing you to raise a fan, move it, or leave the first DIMM slot empty. This kit sidesteps that entirely, making it a safer choice for builds with a big tower cooler or a compact case where clearance is tight. The aluminium spreader still handles thermal dissipation properly, with an onboard thermal sensor monitoring module temperature.

XMP 3.0 and AMD EXPO Ready

Both Intel XMP 3.0 and AMD EXPO profiles are pre-programmed onto the modules, so reaching 6000MHz CL30 is a matter of enabling a profile in the BIOS rather than tuning timings by hand. The kit has been QVL tested with the major motherboard manufacturers for compatibility. The clean white finish and understated design suit white-themed builds where RGB-heavy memory would be a distraction.

Specifications

General

Memory